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Flexible PCB

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  • Specifications
Items Flexible PCB Capability
Max Layer Count 10 Layers
Min Board Thickness 2 mil (0.05mm)
4 mil (0.10mm)
8 mil (0.20mm)
12 mil (0.30mm)
16 mil (0.40mm)
24 mil (0.60mm)
Max Board Thickness 80 mil (2.0mm)
Max Board Dimension 480*480mm
Max Conductor Thickness 4 OZ (140um)
Min Conductor Thickness 1/3 OZ (12um)
Min Trace Width/Space 3/3mil(0.075/0.075mm)
Min Hole Diameter 4mil (0.1mm)
Min Punch Hole Dia 0.1″ (2.5mm)
Min Hole Spacing NPTH:16mil(0.3mm)
PTH:20mil(0.5mm)
Max Aspect Ratio 8:01
Min Solder PAD Dia 10mil(0.25mm) 
Min PAD Ring(Single Side) 3mil (0.075mm)
PTH Wall Thickness 0.59mil (15um) for normal
PTH Dia Tolerance ± 3 mil (0.075mm)
NPTH Dia Tolerance ±2 mil (0.05mm)
Hole Position ±4 mil (0.10mm)
Outline Tolerance Laser: +0.15mm/-0.05mm
Die Punch: +0.10mm/-0.10mm
Min Soldermask Bridge 12 mil(0.3mm)
Min BAG PAD Margin 12 mil(0.3mm)
Impedance Controlled Normal: ± 10%
Value≤50 Ohm: ± 5 Ohm
Thermal Conductivity(W/m.K, or W/m.C) 0.30-0.45
Dielectric Strength ≥1.35 KV /mm
Wrap & Twist ≤ 1%
Flammability 94V-0
Thermal Stress 3 x 10 Sec @ 280 ℃
Surface Treatment ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold plating,ENEPIG, ENIPIG;
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Flexible PCB

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