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HDI PCB

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4 Layers HDI PCB

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  • Specifications
Items HDI PCB Capability
Max Layer Count 28 Layers
Min Board Thickness 16 mil (0.4mm) (4 L)
24 mil (0.6mm) (6 L)
32 mil (0.8mm) (8 L)
40 mil (1.2mm) (10 L)
Max Board Thickness 3+n+3
≥4L: 157mil (4mm)
Max Board Dimension 18.5*24″ (470*610mm) 
Max Conductor Thickness 5oz(6.9mil)
Min Conductor Thickness 1/2 OZ (0.7 mil)
Min Trace Width/Space 3/3 mil
Min PTH Hole Diameter  4mil (0.1mm)
Min PTH slot diameter 20mil (0.50mm)
Min Hole Spacing 12 mil (0.3mm)
Max Aspect Ratio 10:01
Min Solder PAD Dia 10 mil (0.25mm)
Min PAD Ring(Single) 3mil (0.075mm)
PTH Wall Thickness 0.48mil (12 um)
PTH Dia Tolerance ± 3 mil (0.075mm)
NPTH Dia Tolerance ±2 mil (0.05mm)
Hole Position ±2 mil (0.05mm)
Outline Tolerance CNC: ± 6 mil (0.15mm)
Die Punch: ± 4 mil (0.1mm)
Min Soldermask Bridge 4mil(0.10mm)
Min BAG PAD Margin 5 mil (0.125mm)
Impedance Controlled Value>50 ohm: ± 10%
Value≤50 Ohm: ± 5 Ohm
Dielectric Strength > 1.3 KV /mm
Wrap & Twist ≤ 0.75%
Flammability 94V-0
Thermal Stress 3 x 10 Sec @ 280 ℃
Surface Treatment ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold plating,ENEPIG, ENIPIG;HAL, HASL(LF), OSP, Silver Imm., Tin Imm, ENIG+G/F,  Immersion Silver+G/F, Immersion Tin+G/F
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HDI PCB

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