HDI PCB

10 Layers HDI PCB

Items	HDI PCB Capability
Max Layer Count	28 Layers
Min Board Thickness	16 mil (0.4mm) (4 L)
	24 mil (0.6mm) (6 L)
	32 mil (0.8mm) (8 L)
	40 mil (1.2mm) (10 L)
Max Board Thickness	3+n+3
Max Board Thickness	≥4L: 157mil (4mm)
Max Board Dimension	18.524″ (470610mm)
Max Conductor Thickness	5oz(6.9mil)
Min Conductor Thickness	1/2 OZ (0.7 mil)
Min Trace Width/Space	3/3 mil
Min PTH Hole Diameter	4mil (0.1mm)
Min PTH slot diameter	20mil (0.50mm)
Min Hole Spacing	12 mil (0.3mm)
Max Aspect Ratio	10:01
Min Solder PAD Dia	10 mil (0.25mm)
Min PAD Ring(Single)	3mil (0.075mm)
PTH Wall Thickness	0.48mil (12 um)
PTH Dia Tolerance	± 3 mil (0.075mm)
NPTH Dia Tolerance	±2 mil (0.05mm)
Hole Position	±2 mil (0.05mm)
Outline Tolerance	CNC: ± 6 mil (0.15mm)
Outline Tolerance	Die Punch: ± 4 mil (0.1mm)
Min Soldermask Bridge	4mil(0.10mm)
Min BAG PAD Margin	5 mil (0.125mm)
Impedance Controlled	Value>50 ohm: ± 10%
Impedance Controlled	Value≤50 Ohm: ± 5 Ohm
Dielectric Strength	> 1.3 KV /mm
Wrap & Twist	≤ 0.75%
Flammability	94V-0
Thermal Stress	3 x 10 Sec @ 280 ℃
Surface Treatment	ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold plating,ENEPIG, ENIPIG;HAL, HASL(LF), OSP, Silver Imm., Tin Imm, ENIG+G/F, Immersion Silver+G/F, Immersion Tin+G/F