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10 Layers HDI PCB
enquiry- Specifications
| Items | HDI PCB Capability |
| Max Layer Count | 28 Layers |
| Min Board Thickness | 16 mil (0.4mm) (4 L) |
| 24 mil (0.6mm) (6 L) | |
| 32 mil (0.8mm) (8 L) | |
| 40 mil (1.2mm) (10 L) | |
| Max Board Thickness | 3+n+3 |
| ≥4L: 157mil (4mm) | |
| Max Board Dimension | 18.5*24″ (470*610mm) |
| Max Conductor Thickness | 5oz(6.9mil) |
| Min Conductor Thickness | 1/2 OZ (0.7 mil) |
| Min Trace Width/Space | 3/3 mil |
| Min PTH Hole Diameter | 4mil (0.1mm) |
| Min PTH slot diameter | 20mil (0.50mm) |
| Min Hole Spacing | 12 mil (0.3mm) |
| Max Aspect Ratio | 10:01 |
| Min Solder PAD Dia | 10 mil (0.25mm) |
| Min PAD Ring(Single) | 3mil (0.075mm) |
| PTH Wall Thickness | 0.48mil (12 um) |
| PTH Dia Tolerance | ± 3 mil (0.075mm) |
| NPTH Dia Tolerance | ±2 mil (0.05mm) |
| Hole Position | ±2 mil (0.05mm) |
| Outline Tolerance | CNC: ± 6 mil (0.15mm) |
| Die Punch: ± 4 mil (0.1mm) | |
| Min Soldermask Bridge | 4mil(0.10mm) |
| Min BAG PAD Margin | 5 mil (0.125mm) |
| Impedance Controlled | Value>50 ohm: ± 10% |
| Value≤50 Ohm: ± 5 Ohm | |
| Dielectric Strength | > 1.3 KV /mm |
| Wrap & Twist | ≤ 0.75% |
| Flammability | 94V-0 |
| Thermal Stress | 3 x 10 Sec @ 280 ℃ |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold plating,ENEPIG, ENIPIG;HAL, HASL(LF), OSP, Silver Imm., Tin Imm, ENIG+G/F, Immersion Silver+G/F, Immersion Tin+G/F |
HDI PCB
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